Heat Resistant Polyimide Labels For Industrial Use
- Polyimide film face stock
- Survives 260 °C reflow soldering
- Short-term excursions up to 300 °C
- UL 94 V-0 flame-retardant rating
- High-temperature silicone or acrylic adhesive
- Excellent dimensional stability
Heat Resistant Polyimide Labels For Industrial Use Features
Heat Resistant Polyimide Labels For Industrial Use from Vizlent are designed for PCB assembly, battery cell traceability, and other industrial processes that demand reliable identification under aggressive thermal cycling.
Polyimide film retains its mechanical and dimensional properties through wave soldering and lead-free reflow profiles peaking around 260 °C, with short excursions tolerated up to about 300 °C.
The face stock pairs with a high-temperature silicone or acrylic adhesive that resists flow during reflow and maintains long-term bond strength on FR4, ceramic, aluminum, and copper substrates. Combined with resin thermal transfer printing or laser marking, these polyimide labels deliver permanent traceability from board fabrication through end-of-life service.
Specifications
| Item | Heat Resistant Polyimide Labels For Industrial Use |
|---|---|
| Brand | Vizlent |
| Material | Polyimide (PI) film, flame-retardant grade |
| Flame Rating | UL 94 V-0 |
| Temperature Resistance | -40 °C to 260 °C continuous; 300 °C short-term |
| Adhesive Type | High-temperature silicone or acrylic |
| Adhesive Performance | Withstands multiple reflow cycles |
| Thickness | 25–75 μm face stock |
| Color | Matte white, amber, or natural polyimide |
| Printing Compatibility | Resin thermal transfer, laser marking |
| Outgassing | Low; suitable for cleanroom and vacuum use |
| Size | Custom; from 4 × 4 mm upward |
| MOQ | 2,000 pcs |
| Sample | Free stock samples; custom samples chargeable |
| Payment Term | T/T, PayPal, L/C |
| Production Time | 10–15 working days after artwork approval |
Applications:
PCB and PCBA traceability, lithium-ion battery cell marking, automotive ECUs, aerospace electronics, power semiconductor modules, LED driver boards, and high-temperature sensor assemblies.
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Frequently Asked Questions
Yes. We routinely die-cut polyimide labels down to 4 × 4 mm and can produce tighter geometries on request to fit between components. Sheet, fan-fold, and roll formats are available so the labels feed cleanly into print-and-apply systems on the SMT line.
Yes. Our heat resistant polyimide labels are qualified to withstand multiple passes through standard lead-free reflow profiles peaking around 260 °C, retaining barcode legibility and adhesive bond. Short-term excursions to about 300 °C are tolerated for rework and repair operations.
The standard MOQ is 2,000 pieces per SKU to cover material setup and die registration. Lead time is typically 10–15 working days after artwork approval, with pilot batches available for new-customer qualification on case-by-case terms.
Adhesive choice is the most critical attribute after the polyimide film itself, since a substandard adhesive can flow, lift, or off-gas during reflow. VIZLENT specifies high-temperature silicone or acrylic adhesives engineered to remain stable through repeated thermal cycling without contaminating nearby pads.
Yes. The face stock is engineered to accept resin thermal transfer ribbons and CO2 or fiber laser marking, producing high-contrast 1D and 2D codes that survive reflow without smudging. We can recommend ribbon grades and laser parameters once we know your equipment models.
