Flame Retardant Polyimide Label Material
- Polyimide film face stock
- Withstands 260 °C reflow soldering
- UL 94 V-0 self-extinguishing rating
- Stable up to 300 °C short-term
- Excellent chemical and solvent resistance
- Sharp barcode and 2D code reproduction
Flame Retardant Polyimide Label Material Features
Flame Retardant Polyimide Label Material by Vizlent is engineered for printed circuit board assembly and other electronics processes where labels must survive aggressive thermal exposure.
Polyimide film maintains its physical integrity through wave soldering, infrared and convection reflow, and lead-free solder profiles peaking around 260 °C, with short-term excursions tolerated up to 300 °C.
The face stock combines flame retardancy with a high-temperature silicone or acrylic adhesive that bonds reliably to PCB laminates, ceramic substrates, and metal heat spreaders without flowing or off-gassing significantly during reflow.
The resulting polyimide label material retains barcode legibility for full traceability from PCB fab through field service.
Specifications
| Item | Flame Retardant Polyimide Label Material |
|---|---|
| Brand | Vizlent |
| Material | Polyimide (PI) film, flame-retardant grade |
| Flame Rating | UL 94 V-0 |
| Temperature Resistance | -40 °C to 260 °C continuous; 300 °C short-term |
| Adhesive Type | High-temperature silicone or acrylic |
| Adhesive Performance | Survives multiple reflow cycles without lifting |
| Thickness | 25–75 μm face stock |
| Color | Matte white, amber, or natural polyimide |
| Printing Compatibility | Resin thermal transfer, laser marking |
| Size | Custom; from 4 × 4 mm up to 50 × 25 mm typical |
| Outgassing | Low; suitable for cleanroom and vacuum use |
| MOQ | 2,000 pcs |
| Sample | Free existing samples; custom samples chargeable |
| Payment Term | T/T, PayPal, L/C |
| Production Time | 10–15 working days after artwork approval |
Applications:
PCB traceability barcodes, lithium-ion cell identification, automotive ECUs, aerospace electronics, semiconductor packaging, power module marking, and high-temperature motor and transformer assemblies.
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Frequently Asked Questions
Yes. We routinely die-cut polyimide labels down to 4 × 4 mm and can supply tighter geometries on request to fit constrained PCB layouts. Sheet, fan-fold, and roll formats are available so the labels feed reliably into your existing print-and-apply equipment.
Yes. Our flame retardant polyimide label material is qualified to withstand multiple passes through standard lead-free reflow profiles peaking around 260 °C, with the face stock and adhesive maintaining adhesion and barcode legibility. Short-term excursions to about 300 °C are tolerated for processes such as solder repair.
The standard MOQ is 2,000 pieces per SKU to cover material setup and registration on our die-cutting line. Lead time is typically 10–15 working days after artwork approval, and we can support pilot batches for new customer qualification on case-by-case terms.
For PCBs and battery packs the flame rating is one of the most critical attributes because the label sits permanently inside the assembly. VIZLENT sources polyimide film rated to UL 94 V-0 and can provide manufacturer test data and UL file references during the qualification process.
Yes. The face stock is engineered to accept resin thermal transfer ribbons and CO2 or fiber laser marking, producing high-contrast 1D and 2D codes that survive reflow without smudging. We can recommend ribbon grades and laser parameters once we know the specific equipment models in your line.
